现代防御技术 ›› 2021, Vol. 49 ›› Issue (2): 106-110.doi: 10.3969/j.issn.1009-086x.2021.02.016

• 测试、发射技术 • 上一篇    下一篇

Ku波段功分放大3D-MCM设计

赵昱萌, 凡守涛, 韩宇, 王川   

  1. 北京遥感设备研究所,北京 100854
  • 收稿日期:2020-11-04 修回日期:2020-12-21 出版日期:2021-04-20 发布日期:2021-04-30
  • 作者简介:赵昱萌(1996-),女,北京人。硕士生,主要研究方向为微波电路。通信地址:100854 北京市142信箱205分箱2# E-mail:1359403234@qq.com
  • 基金资助:

Design of Ku-Band Power Division Amplification 3D-MCM

ZHAO Yu-meng, FAN Shou-tao, HAN Yu, WANG Chuan   

  1. Beijing Institute of Remote Sensing Equipment,Beijing 100854,China
  • Received:2020-11-04 Revised:2020-12-21 Online:2021-04-20 Published:2021-04-30

摘要: 多芯片组件(three-dimensional multi-chip module,MCM)是微波产品的重要组成部分,其集成度的高低将直接影响到产品的小型化与轻量化。当前,军用领域绝大多数的MCM使用的还是传统的二维多芯片组件(2D-MCM)形式。为了实现更高的集成密度,MCM需要向三维多芯片组件(3D-MCM)方向发展。微波垂直互连工艺是3D-MCM的基础,是实现微波产品小型化与轻量化的关键技术,但在Ku波段微波信号的传输匹配上具有较大设计复杂度。在对3D-MCM仿真的基础上设计了一款Ku波段功分放大3D-MCM,与传统2D-MCM相比,在性能指标不变的情况下体积可缩小40%以上。

关键词: 微波, 三维多芯片组件, 垂直互连, 小型化, 轻量化

Abstract: The multi-chip module (MCM) plays an important role in microwave products. Its level of integration directly affect the miniaturization and lightweight of products.So far the vast majority of MCM in the military field still adopt the traditional two-dimensional multi-chip module (2D-MCM) form.For higher integration density,MCM should be transformed into the three-dimensional multi-chip module (3D-MCM) form.The microwave vertical interconnection process,which is the basis for 3D-MCM,is a key technology to realize the miniaturization and light weight of microwave products.But it has greater design complexity in the transmission and matching of microwave signals in the Ku band.On the basis of 3D-MCM simulation,a Ku band power division amplification is designed.Under the same performance index,the volume can be reduced by more than 40% compared with the products adopting traditional 2D-MCM.

Key words: microwave, three-dimensional multi-chip module (MCM), vertical interconnection, miniaturization, lightweight

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