现代防御技术 ›› 2023, Vol. 51 ›› Issue (5): 118-125.DOI: 10.3969/j.issn.1009-086x.2023.05.015

• 测试、发射技术 • 上一篇    下一篇

热电池激活过程倒灌电流影响因素研究

盛德卫, 王臻, 王龙启, 马晓东   

  1. 北京电子工程总体研究所,北京 100854
  • 收稿日期:2022-09-14 修回日期:2022-11-03 出版日期:2023-10-28 发布日期:2023-11-02
  • 作者简介:盛德卫(1987-),男,山东禹城人。高工,硕士,研究方向为弹上电气系统设计与试验技术。

Influencing Factors of Backflow Current During Thermal Battery Activation

Dewei SHENG, Zhen WANG, Longqi WANG, Xiaodong MA   

  1. Beijing Institute of Electronic System Engineering,Beijing 100854,China
  • Received:2022-09-14 Revised:2022-11-03 Online:2023-10-28 Published:2023-11-02

摘要:

热电池因具有能量密度高、使用温度范围宽、耐瞬间大脉冲能力强、激活时间短、储存寿命长等优点被广泛用于各种战术武器中。热电池输出端作为与导弹对接的电气接口,其激活过程中倒灌电流的大小将直接影响弹上电子设备工作的可靠性。为了解热电池激活过程中倒灌电流变化规律,对其影响因素进行了研究。通过研究表明,倒灌电流大小与电池堆并联数量、引燃条燃速、加热片燃速、极片面积大小、电解质熔融速度、电池堆单体电池串联数量、电发火头激活方式、线阻大小及弹上负载功率大小有关。该结论为导弹电气系统的安全、可靠供电电路设计提供了有力支撑。

关键词: 导弹, 电气系统, 热电池, 激活过程, 倒灌电流, 影响因素

Abstract:

Thermal batteries are widely employed in various tactical weapons due to their high energy density, wide temperature range, strong instantaneous pulse resistance, short activation time, and long storage life. The output end of the thermal battery is the electrical interface for docking with the missile, and its backflow current during activation directly affects the reliability of the electronic equipment on the missile. Meanwhile, the influencing factors are studied to grasp the variation law of backflow current during thermal battery activation. The research shows that the backflow current is related to the number of parallel battery stack connections, the burning rate of the pilot strip, the burning rate of the heating plate, the stage plate area, the melting rate of the electrolyte, the number of single cells in series of the battery stack, the activation mode of the ignition head, line resistance, and the load power on the missile. This conclusion provides favorable support for designing a safe and reliable power supply circuit for the missile electrical system.

Key words: missile, electrical system, thermal battery, activation process, backflow current, influencing factors

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